| 摘要 |
PROBLEM TO BE SOLVED: To provide: a film-like printed circuit board which uses a general-purpose base material of a low melting point, and by which a circuit can be formed in a short time at a low temperature to mount an electronic component; and a method for manufacturing such a film-like printed circuit board.SOLUTION: A film-like printed circuit board comprises: a low-melting point resin film base material consisting of a low-melting point resin having a melting point of 370°C or below; a circuit formed by applying a conductive paste for circuit formation onto the low-melting point resin film base material and baking it by means of plasma; an electronic component adhesion layer formed by applying a conductive paste for mount use onto the circuit and baking it by means of plasma; and an electronic component mounted on the circuit through the electronic component adhesion layer.SELECTED DRAWING: None |
