HEATPIPE IMBEDDED COLDPLATE ENHANCING IGBT HEAT SPREADING

摘要

A cold plate for a power circuit is disclosed. The power circuit includes a plurality of transistors and each of the plurality of transistors includes a plurality of dies. The cold plate includes a liquid cooling system that includes a plurality of cooling channels and each of the plurality of cooling channels is aligned with at least one die. The liquid cooling system includes a heat sink associated with each of the plurality of cooling channels. The cold plate further includes a plurality of heat pipes, wherein each of the plurality of heat pipes is aligned with at least one of the plurality of cooling channels and at least one die. Each heat pipe includes a wick lining an interior of the heat pipe, a vapor flow area, and a fluid.

主权项

1. A cold plate for a power circuit, the power circuit including a plurality of transistors, the plurality of transistors each including a plurality of dies, the cold plate comprising:
a liquid cooling system, the liquid cooling system including a plurality of cooling channels, each of the plurality of cooling channels being aligned with at least one die of the plurality of dies, and a heat sink associated with each of the plurality of cooling channels; and a plurality of heat pipes, each of the plurality of heat pipes being aligned with at least one of the plurality of cooling channels and at least one die of the plurality of dies, each of the plurality of heat pipes including a wick lining an interior of the heat pipe, a vapor flow area, and a fluid.