| 发明名称 |
METHOD OF MANUFACTURING A FLEXIBLE PRINTED CIRCUIT BOARD INCLUDING A SOLDER RESIST LAYER |
| 摘要 |
A method for manufacturing a flexible printed circuit module includes discharging an insulating material from an inkjet head towards a surface of a flexible printed circuit board, such that an electrode on the surface of the flexible printed circuit board is exposed, and curing the insulating material to be formed. |
| 申请公布号 |
US2016143150(A1) |
申请公布日期 |
2016.05.19 |
| 申请号 |
US201514842283 |
申请日期 |
2015.09.01 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
HAPPOYA Akihiko;TOKUDA Kota |
| 分类号 |
H05K3/00;B41J2/01 |
主分类号 |
H05K3/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for manufacturing a flexible printed circuit module, comprising:
discharging an insulating material from an inkjet head towards a surface of a flexible printed circuit board, such that an electrode on the surface of the flexible printed circuit board is exposed; and curing the insulating material to be formed. |
| 地址 |
Tokyo JP |
