发明名称 |
Method and Apparatus for Low Resistance Image Sensor Contact |
摘要 |
A method and apparatus for a low resistance image sensor contact, the apparatus comprising a photosensor disposed in a substrate, a first ground well disposed in a first region of the substrate, the first ground well having a resistance lower than the substrate, and a ground line disposed in a region adjacent to the first ground well. The first ground well is configured to provide a low resistance path to the ground line from the substrate for excess free carriers in the first region of the substrate. The apparatus may optionally comprise a second ground well having a lower resistance than the first ground well and disposed between the first ground well and the ground line, and may further optionally comprise a third ground well having a lower resistance than the second ground well and disposed between the second ground well and the ground line. |
申请公布号 |
US2016141325(A1) |
申请公布日期 |
2016.05.19 |
申请号 |
US201615005803 |
申请日期 |
2016.01.25 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Kao Min-Feng;Yaung Dun-Nian;Liu Jen-Cheng;Hung Feng-Chi;Chuang Chun-Chieh;Tsai Shuang-Ji;Lin Jeng-Shyan |
分类号 |
H01L27/146;H01L31/18 |
主分类号 |
H01L27/146 |
代理机构 |
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代理人 |
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主权项 |
1. A method of forming a semiconductor device, the method comprising:
forming a first ground well in a substrate, the first ground well having a first dopant concentration of a first conductivity type, the first dopant concentration being greater than a dopant concentration of first conductivity type in an underlying region of the substrate; forming a photosensor in a first region of the substrate and separate from the first ground well; forming a dielectric layer on the substrate; and forming a metal trace ground contact directly over the first ground well, the metal trace ground contact extending through the dielectric layer and into the substrate. |
地址 |
Hsin-Chu TW |