| 发明名称 |
FLIP-CHIP BONDER WITH INDUCTION COILS |
| 摘要 |
A method and apparatus for flip chip bonding using conductive and inductive heating to heat a plurality of solder bumps located between a chip carrier and a chip. |
| 申请公布号 |
US2016141264(A1) |
申请公布日期 |
2016.05.19 |
| 申请号 |
US201414543950 |
申请日期 |
2014.11.18 |
| 申请人 |
International Business Machines Corporation |
发明人 |
Nah Jae-woong;Quesnel Sébastien S.;Sakuma Katsuyuki |
| 分类号 |
H01L23/00;H05B6/06;H05B6/10;B23K1/002 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of forming a flip chip assembly comprising joining a chip to a chip carrier with a plurality of solder bumps, wherein joining the chip to the chip carrier comprises heating the solder bumps to a temperature greater than the reflow temperature of the plurality of solder bumps using conductive heating and inductive heating. |
| 地址 |
Armonk NY US |
