SUBSTRATE CLEANING APPARATUS, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE CLEANING METHOD

摘要

A substrate cleaning apparatus capable of removing fine particles from a substrate, such as a wafer, without using a chemical liquid is disclosed. The substrate cleaning apparatus includes: a substrate supporting structure for supporting the substrate; a vibration device secured to the substrate supporting structure; a vibration controller configured to cause the vibration device to vibrate at a natural frequency of the substrate; and a cleaning liquid supply nozzle configured to supply a cleaning liquid onto the substrate.

主权项

1. A substrate cleaning apparatus comprising:
a substrate supporting structure configured to support a substrate; a vibration device secured to the substrate supporting structure; a vibration controller configured to cause the vibration device to vibrate at a natural frequency of the substrate; and a cleaning liquid supply nozzle configured to supply a cleaning liquid onto the substrate.