MULTI-LAYER PRINTED CIRCUIT BOARD WITH AN INTEGRATED PLASTICALLY BENDABLE THICK-COPPER PROFILE

摘要

The invention relates to a multi-layer printed circuit board comprising at least one bendable segmented part, at least one functional element designed to be bent being integrated into a bending section of the segmented part and at least one notch edge being arranged in said bending section. The printed circuit board is designed to be partially bendable at least in said section and at least one thick-copper profile is arranged as a functional element in the bending section of the at least one bendable segmented part, the profile being permanently deformable once it has been bent.