| 发明名称 |
ELECTRONIC DEVICE MODULE AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
The electronic device module and method thereof includes a board, an electronic device, a sealing part, and a connection conductor. The board includes external connection electrodes. The electronic device is mounted on the board. The sealing part is configured to seal the electronic device. The connection conductor is configured to penetrate through the sealing part and including one end bonded to the external connection electrodes of the board. One of the external connection electrodes includes a reinforcing via disposed in the board. |
| 申请公布号 |
US2016143147(A1) |
申请公布日期 |
2016.05.19 |
| 申请号 |
US201514923992 |
申请日期 |
2015.10.27 |
| 申请人 |
Samsung Electro-Mechanics Co., Ltd. |
发明人 |
PARK Min Woo;JUNG Seung Pil |
| 分类号 |
H05K1/18;H05K3/30;H05K1/11 |
主分类号 |
H05K1/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic device module, comprising:
a board comprising external connection electrodes; an electronic device mounted on the board; a sealing part configured to seal the electronic device; and a connection conductor configured to penetrate through the sealing part and comprising one end bonded to the external connection electrodes of the board, wherein one of the external connection electrodes comprises a reinforcing via disposed in the board. |
| 地址 |
Suwon-si KR |
