发明名称 FLEXIBLE ELECTRONIC DEVICE
摘要 A flexible electronic device including a flexible panel and an auxiliary layer is provided. The flexible panel has a plurality of operation portions, wherein a predetermined bending portion disposed between each adjacent two of the operation portions. The auxiliary layer is disposed on a surface of the flexible panel and at least located above the predetermined bending portion. The predetermined bending portion of the flexible panel may be bent in a first bending state for the auxiliary layer to be in contact with the predetermined bending portion, and a radius of curvature of the auxiliary layer is greater than a radius of curvature of the predetermined bending portion. The flexible electronic device has a first compressive stress region and a first tensile stress region, and a range of the first compressive stress region is greater than a range of the first tensile stress region.
申请公布号 US2016143130(A1) 申请公布日期 2016.05.19
申请号 US201514691588 申请日期 2015.04.21
申请人 Industrial Technology Research Institute 发明人 Wu Cheng-Che;Tsai Chen-Chu;Tsai Chia-Hao
分类号 H05K1/02;H05K5/00 主分类号 H05K1/02
代理机构 代理人
主权项 1. A flexible electronic device, comprising: a flexible panel having a plurality of operation portions and a predetermined bending portion disposed between each adjacent two of the operation portions, wherein the flexible panel comprises at least one brittle material layer manufactured by a brittle material; and an auxiliary layer, disposed on a surface of the flexible panel and at least located above the predetermined bending portion, wherein when the predetermined bending portion of the flexible panel is in a first bending state, the auxiliary layer is in contact with the predetermined bending portion, and a radius of curvature of the auxiliary layer is greater than a radius of curvature of the predetermined bending portion, and wherein in the first bending state, the flexible electronic device has a first compressive stress region and a first tensile stress region, a range of the first compressive stress region is greater than a range of the first tensile stress region, and the brittle material layer manufactured by the brittle material is located in the first compressive stress region.
地址 Hsinchu TW