| 发明名称 |
THROUGH-PACKAGE-VIA (TPV) STRUCTURES ON INORGANIC INTERPOSER AND METHODS FOR FABRICATING SAME |
| 摘要 |
Disclosed herein are, for instance, methods for producing through package vias in a glass interposer. For instance, disclosed herein is a method for producing through package vias in a glass interposer comprising laminating a polymer on at least a portion of a top surface of a glass interposer, removing at least a portion of the polymer and the glass interposer to form a through via, filling at least a portion of the through via with a metal conductor to form a metallization layer, and selectively removing a portion of the metallization layer to form a metalized through package via. Other methods are also disclosed, along with through-package-via structures in glass interposers produced therefrom. |
| 申请公布号 |
US2016141257(A1) |
申请公布日期 |
2016.05.19 |
| 申请号 |
US201615005275 |
申请日期 |
2016.01.25 |
| 申请人 |
GEORGIA TECH RESEARCH CORPORATION |
发明人 |
Sundaram Venkatesh;Liu Fuhan;Tummala Rao R.;Sukumaran Vijay;Sridharan Vivek;Chen Qiao |
| 分类号 |
H01L23/00;H01L23/498;H01L21/48 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for producing through package vias in a glass interposer, comprising:
laminating a polymer on at least a portion of a top surface of a glass interposer; removing at least a portion of the polymer and the glass interposer to form a through via; filling at least a portion of the through via with a metal conductor to form a metallization layer; and selectively removing a portion of the metallization layer to form a metalized through package via. |
| 地址 |
Atlanta GA US |
