发明名称 |
CHIP PACKAGE AND METHOD FOR FORMING THE SAME |
摘要 |
An embodiment of the invention provides a chip package which includes: a semiconductor substrate having a first surface and a second surface; a first recess extending from the first surface towards the second surface; a second recess extending from a bottom of the first recess towards the second surface, wherein a sidewall and the bottom of the first recess and a second sidewall and a second bottom of the second recess together form an exterior side surface of the semiconductor substrate; a wire layer disposed over the first surface and extending into the first recess and/or the second recess; an insulating layer positioned between the wire layer and the semiconductor substrate; and a metal light shielding layer disposed over the first surface and having at least one hole, wherein a shape of the at least one hole is a quadrangle. |
申请公布号 |
US2016141254(A1) |
申请公布日期 |
2016.05.19 |
申请号 |
US201615008202 |
申请日期 |
2016.01.27 |
申请人 |
XINTEC INC. |
发明人 |
LIN Yi-Min;CHANG Yi-Ming;CHANG Shu-Ming;HO Yen-Shih;LIU Tsang-Yu;CHENG Chia-Ming |
分类号 |
H01L23/552;H01L23/544;H01L23/00;H01L21/78 |
主分类号 |
H01L23/552 |
代理机构 |
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代理人 |
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主权项 |
1. A method for forming a chip package, comprising:
providing at least one semiconductor substrate having a first surface and a second surface; removing a portion of the semiconductor substrate from the first surface to form a first recess and a second recess, wherein the first recess extends towards the second surface, and the second recess extends from a bottom of the first recess towards the second surface; forming an insulating layer over the first surface, wherein the insulating layer extends into the first recess and the second recess; forming a wire layer over the insulating layer, wherein the wire layer extends into the first recess and/or the second recess; forming a metal light shielding layer over the insulating layer, wherein the metal light shielding layer has at least one hole, and a shape of the at least one hole is a quadrangle; and performing a dicing process along at least one predetermined scribe line of the semiconductor substrate to form at least one chip package, wherein a sidewall and the bottom of the first recess and a second sidewall and a second bottom of the recess together form an exterior side surface of the semiconductor substrate after the dicing process. |
地址 |
Taoyuan City TW |