发明名称 |
METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE AND INTERMEDIATE ASSEMBLY UNIT OF THE SAME |
摘要 |
A method for manufacturing a semiconductor module includes the step of soldering two or more semiconductor elements having substrate materials and heights different from each other to a metal foil disposed at one side of an insulating substrate; connecting a plurality of wiring members, not interconnecting the semiconductor elements, to front face electrodes of the semiconductor elements through solder so that heights from a surface of the insulating substrate to top faces of the wiring members become same level with each other; inspecting a leakage current while applying electricity on each one of semiconductor elements individually through the wiring members; and connecting the top faces of the wiring members with a bus bar. |
申请公布号 |
US2016141214(A1) |
申请公布日期 |
2016.05.19 |
申请号 |
US201514877334 |
申请日期 |
2015.10.07 |
申请人 |
FUJI ELECTRIC CO., LTD. |
发明人 |
SATO Kenichiro |
分类号 |
H01L21/66;H01L21/48;H01L23/498 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
1. A method for manufacturing a semiconductor module comprising the step of:
soldering two or more semiconductor elements having substrate materials and heights different from each other to a metal foil disposed at one side of an insulating substrate; connecting a plurality of wiring members, not interconnecting the semiconductor elements, to front face electrodes of the semiconductor elements through solder so that heights from a surface of the insulating substrate to top faces of the wiring members become same level with each other; inspecting a leakage current while applying electricity on each of the semiconductor elements individually through the wiring members; and connecting the top faces of the wiring members with a bus bar. |
地址 |
Kawasaki-shi JP |