PROCESS FOR TRANSFERRING LAYERS

摘要

The invention relates to a process for transferring an active layer to a final substrate using a temporary substrate, the active layer comprises a first side having a three-dimensional surface topology, the process comprising: a first step of bonding the first side of the active layer to one side of the temporary substrate; a second step of bonding a second side of the active layer to the final substrate; and a third step of separating the active layer and the temporary substrate; the process being characterized in that the side of the temporary substrate possesses a surface topology complementary to the surface topology of the first side of the active layer, so that the surface topology of the temporary substrate encapsulates the surface topology of the first side of the active layer in the bonding first step.

主权项

1. A process for transferring an active layer to a final substrate using a temporary substrate, the active layer having a first side having a three-dimensional surface topology, the process comprising:
a first step of bonding the first side of the active layer having the three-dimensional surface topology to one side of the temporary substrate, the one side of the temporary substrate having a three-dimensional surface topology complementary to the surface topology of the first side of the active layer such that the surface topology of the temporary substrate encapsulates the surface topology of the first side of the active layer; a second step of bonding a second side of the active layer to the final substrate; and a third step of separating the active layer and the temporary substrate.