发明名称 |
PCI EXPRESS TUNNELING OVER A MULTI-PROTOCOL I/O INTERCONNECT |
摘要 |
Described are embodiments of methods, apparatuses, and systems for PCIe tunneling across a multi-protocol I/O interconnect of a computer apparatus. A method for PCIe tunneling across the multi-protocol I/O interconnect may include establishing a first communication path between ports of a switching fabric of a multi-protocol I/O interconnect of a computer apparatus in response to a peripheral component interconnect express (PCIe) device being connected to the computer apparatus, and establishing a second communication path between the switching fabric and a PCIe controller. The method may further include routing, by the multi-protocol I/O interconnect, PCIe protocol packets of the PCIe device from the PCIe device to the PCIe controller over the first and second communication paths. Other embodiments may be described and claimed. |
申请公布号 |
US2016140069(A1) |
申请公布日期 |
2016.05.19 |
申请号 |
US201615005279 |
申请日期 |
2016.01.25 |
申请人 |
INTEL CORPORATION |
发明人 |
Harriman David J.;Dan Maxim |
分类号 |
G06F13/40;G06F13/42 |
主分类号 |
G06F13/40 |
代理机构 |
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代理人 |
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主权项 |
1. An I/O interconnect apparatus comprising:
a switch fabric, the switch fabric comprising a plurality of ports, including a first port, a second port, and a third port; wherein the first port is to communicatively couple a first controller to the I/O interconnect, to implement a first layer of a first protocol, and to encapsulate packets of the first protocol into packets of the I/O interconnect; wherein the second port is to communicatively couple a second controller to the I/O interconnect, to implement a first layer of a second protocol, and to encapsulate packets of the second protocol into packets of the I/O interconnect; andwherein the third port is to communicatively couple a peripheral device to the I/O interconnect. |
地址 |
SANTA CLARA CA US |