发明名称 PCI EXPRESS TUNNELING OVER A MULTI-PROTOCOL I/O INTERCONNECT
摘要 Described are embodiments of methods, apparatuses, and systems for PCIe tunneling across a multi-protocol I/O interconnect of a computer apparatus. A method for PCIe tunneling across the multi-protocol I/O interconnect may include establishing a first communication path between ports of a switching fabric of a multi-protocol I/O interconnect of a computer apparatus in response to a peripheral component interconnect express (PCIe) device being connected to the computer apparatus, and establishing a second communication path between the switching fabric and a PCIe controller. The method may further include routing, by the multi-protocol I/O interconnect, PCIe protocol packets of the PCIe device from the PCIe device to the PCIe controller over the first and second communication paths. Other embodiments may be described and claimed.
申请公布号 US2016140069(A1) 申请公布日期 2016.05.19
申请号 US201615005279 申请日期 2016.01.25
申请人 INTEL CORPORATION 发明人 Harriman David J.;Dan Maxim
分类号 G06F13/40;G06F13/42 主分类号 G06F13/40
代理机构 代理人
主权项 1. An I/O interconnect apparatus comprising: a switch fabric, the switch fabric comprising a plurality of ports, including a first port, a second port, and a third port; wherein the first port is to communicatively couple a first controller to the I/O interconnect, to implement a first layer of a first protocol, and to encapsulate packets of the first protocol into packets of the I/O interconnect; wherein the second port is to communicatively couple a second controller to the I/O interconnect, to implement a first layer of a second protocol, and to encapsulate packets of the second protocol into packets of the I/O interconnect; andwherein the third port is to communicatively couple a peripheral device to the I/O interconnect.
地址 SANTA CLARA CA US