发明名称 METHOD OF MANUFACTURING SURFACE PANEL
摘要 A method manufactures a front panel including a front panel body formed of a single transmissive resin layer and a sensor film attached thereto, using a first mold having a molding recessed portion and a second mold having a molding projecting portion. The first and second molds are joined together such that a cavity is formed between the molding recessed portion and the molding projecting portion, by placing the sensor film between the first mold and the second mold, on the molding projecting portion in the cavity. A melted resin is injected into the cavity to form the single transmissive resin layer having a front surface formed in a shape of the molding recessed portion, and a back surface formed along the sensor film in a shape of the molding projecting portion, thereby laminating the sensor film to the back surface of the transmissive resin layer.
申请公布号 US2016139632(A1) 申请公布日期 2016.05.19
申请号 US201615004784 申请日期 2016.01.22
申请人 ALPS ELECTRIC CO., LTD. 发明人 OKAWARA Shinji;KATONO Hajime;TOKUTA Mitsuru
分类号 G06F1/16;B29C45/14;G06F3/041 主分类号 G06F1/16
代理机构 代理人
主权项 1. A method of manufacturing a front panel including a front panel body formed of a single transmissive resin layer and a sensor film attached to the transmissive resin layer, the sensor film configured to sense presence of a human finger in proximity thereto, the method using a first mold having a molding recessed portion and a second mold having a molding projecting portion, the method comprising: providing a sensor film, including: a single-layered base film made of a transmissive material, having a first surface and a second surface opposite to the first surface;a transmissive electrode layer formed on the second surface in a center region thereof;a wiring layer formed on the second surface in a peripheral region surrounding the center region, the wiring layer connected to the transmissive electrode layer, the wiring layer being a conductive organic layer; anda decorative portion formed on the first surface, the decorative portion covering the wiring layer; placing a sensor film between the first mold and the second mold; joining the first mold and the second mold together such that a cavity is formed between the molding recessed portion and the molding projecting portion and the sensor film is placed on the molding projecting portion in the cavity; and injecting a melted resin into the cavity to form a single transmissive resin layer, the injecting the melted resin including: forming a front surface of the transmissive resin layer in a shape of the molding recessed portion; andforming a back surface of the transmissive resin layer along the sensor film in a shape of the molding projecting portion, thereby laminating the sensor film to the back surface of the transmissive resin layer, wherein the transmissive electrode layer is positioned in a first region corresponding to a back main surface of the transmissive resin layer, the wiring layer is positioned in a second region corresponding to at least one of a back right-side surface and a back left-side surface of the transmissive resin layer extending backward from the back main surface, the single-layered base film extends along the back main surface, the back right-side surface, and the back left-side surface, the decorative portion is provided on the first surface of the single-layered base film in the second region so as to hide the wiring layer viewed from the front surface, and the decorative portion, the single-layered base film, and the wiring layer form a three-layered structure in the second region, and wherein the transmissive electrode layer is disposed in a transmissive region surrounded by the decorative portion formed in a shape of a frame.
地址 Tokyo JP