CYLINDRICAL SPUTTERING TARGET AND PROCESS FOR PRODUCING THE SAME

摘要

Provided is a cylindrical ceramic sputtering target, which significantly reduces the occurrence of a crack, a chip, extraordinary discharge and a nodule.;By filling a molten bonding material in a cavity defined by a cylindrical ceramic target material and a cylindrical base material, starting cooling the molten bonding material from its one end toward its other end in a cylindrical axial direction in sequence, and further filling the molten bonding material in the cavity during cooling, a cylindrical ceramic sputtering target is manufactured so as to be characterized in that as observed by an X-ray radiograph of the bonding material, the total area of portions where no bonding material exists is 10 cm2 or less per 50 cm2 of X-ray radiograph area, and the maximum area of the portions where no bonding material exists is 9 cm2 or less.

主权项

1. A process for producing a cylindrical ceramic sputtering target comprising a bonding material filled in a cavity defined by a cylindrical ceramic target material and a cylindrical base material, wherein as observed by an X-ray radiograph of the bonding material, the total area of portions where no bonding material exists is 10 cm2 or less per 50 cm2 of X-ray radiograph area, and the maximum area of the portions where no bonding material exists is 9 cm2 or less and wherein the volume ratio of the bonding material at 25° C. that is filled in the cavity is at least 96.8% with respect to the volume of the cavity at the melting point of the bonding material, said process comprising filling a molten bonding material in a cavity, starting cooling the molten bonding material from its one end toward its other end in a cylindrical axial direction in sequence, and further filling the molten bonding material in the cavity during cooling.