发明名称 |
ELECTROCONDUCTIVE-FILM-FORMING COMPOSITION AND METHOD FOR PRODUCING ELECTROCONDUCTIVE FILM |
摘要 |
An electroconductive-film-forming composition capable of forming an electroconductive film having excellent conductivity and few voids and a method for producing an electroconductive film using the same. The electroconductive-film-forming composition contains copper particles having an average particle diameter of 1 nm to 10 copper oxide particles having an average particle diameter of 1 nm to 500 nm, a reducing agent having a hydroxy group, a metal catalyst including metals other than copper, and a solvent, in which the content of the copper oxide particles is 50% by mass to 300% by mass with respect to the content of the copper particles, the content of the reducing agent is 100 mol % to 800 mol % with respect to the content of the copper oxide particles, and the content of the metal catalyst is 10% by mass or less with respect to the content of the copper oxide particles. |
申请公布号 |
US2016137855(A1) |
申请公布日期 |
2016.05.19 |
申请号 |
US201615002464 |
申请日期 |
2016.01.21 |
申请人 |
FUJIFILM Corporation |
发明人 |
Tsuyama Hiroaki;Watanabe Toru;Hayata Yuuichi |
分类号 |
C09D5/24 |
主分类号 |
C09D5/24 |
代理机构 |
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代理人 |
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主权项 |
1. An electroconductive-film-forming composition comprising:
copper particles having an average particle diameter of 1 nm to 10 μm; copper oxide particles having an average particle diameter of 1 nm to 500 nm; a reducing agent having a hydroxy group; a metal catalyst including metals other than copper; and a solvent, wherein the content of the copper oxide particles is 50% by mass to 300% by mass with respect to the content of the copper particles, the content of the reducing agent is 100 mol % to 800 mol % with respect to the content of the copper oxide particles, and the content of the metal catalyst is 10% by mass or less with respect to the content of the copper oxide particles. |
地址 |
Tokyo JP |