发明名称 ELECTROCONDUCTIVE-FILM-FORMING COMPOSITION AND METHOD FOR PRODUCING ELECTROCONDUCTIVE FILM
摘要 An electroconductive-film-forming composition capable of forming an electroconductive film having excellent conductivity and few voids and a method for producing an electroconductive film using the same. The electroconductive-film-forming composition contains copper particles having an average particle diameter of 1 nm to 10 copper oxide particles having an average particle diameter of 1 nm to 500 nm, a reducing agent having a hydroxy group, a metal catalyst including metals other than copper, and a solvent, in which the content of the copper oxide particles is 50% by mass to 300% by mass with respect to the content of the copper particles, the content of the reducing agent is 100 mol % to 800 mol % with respect to the content of the copper oxide particles, and the content of the metal catalyst is 10% by mass or less with respect to the content of the copper oxide particles.
申请公布号 US2016137855(A1) 申请公布日期 2016.05.19
申请号 US201615002464 申请日期 2016.01.21
申请人 FUJIFILM Corporation 发明人 Tsuyama Hiroaki;Watanabe Toru;Hayata Yuuichi
分类号 C09D5/24 主分类号 C09D5/24
代理机构 代理人
主权项 1. An electroconductive-film-forming composition comprising: copper particles having an average particle diameter of 1 nm to 10 μm; copper oxide particles having an average particle diameter of 1 nm to 500 nm; a reducing agent having a hydroxy group; a metal catalyst including metals other than copper; and a solvent, wherein the content of the copper oxide particles is 50% by mass to 300% by mass with respect to the content of the copper particles, the content of the reducing agent is 100 mol % to 800 mol % with respect to the content of the copper oxide particles, and the content of the metal catalyst is 10% by mass or less with respect to the content of the copper oxide particles.
地址 Tokyo JP