发明名称 |
THERMOSET RESIN COMPOSITION, AND PREPREG AND LAMINATED BOARD MADE OF SAME |
摘要 |
The present invention relates to a thermoset resin composition and prepreg made of the same and laminated board. The thermoset resin composition comprises the following constituents in parts by weight: 50-150 parts of cyanate; 30-120 parts of epoxy resin; 20-70 parts of allyl benzene maleic anhydride; 20-100 parts of polyphenyl ether; 30-100 parts of halogen-free flame retardant; 0.05-5 parts of curing accelerant; 50-200 parts of filler. The prepreg and the laminated board made of the thermoset resin composition have comprehensive performance such as low dielectric constant, low dielectric loss, superior flame retardancy, thermal resistance and wet resistance etc., and is suitable for use in a halogen-free high-frequency multilayer circuit board. |
申请公布号 |
WO2016074289(A1) |
申请公布日期 |
2016.05.19 |
申请号 |
WO2014CN92840 |
申请日期 |
2014.12.02 |
申请人 |
SHENGYI TECHNOLOGY CO., LTD. |
发明人 |
FANG, KEHONG;LI, HUI |
分类号 |
C08L79/04;B32B15/08;B32B15/092;B32B27/04;C08L35/06;C08L63/00;C08L71/12;H05K1/03 |
主分类号 |
C08L79/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|