| 摘要 |
PROBLEM TO BE SOLVED: To achieve cost reduction of a multi-pin semiconductor device.SOLUTION: A flip-chip connected BGA comprises: a plurality of signal bonding electrodes 2k which are arranged on an outer periphery of a top face of a multilayer wiring board and extracted inside and outside in a distributed manner; and a plurality of signal through holes 2q which are connected with a plurality of signal wiring 2u extracted inside and arranged in a region between an electrode row of the plurality of signal bonding electrodes 2k and a central part where a plurality of core power supply bonding electrodes are arranged. With this configuration, a pad pitch between chips can be reduced to achieve cost reduction of the BGA without increase on the number of layers of the multilayer wiring board.SELECTED DRAWING: Figure 13 |
