| 摘要 |
PROBLEM TO BE SOLVED: To provide a light emitting device and a package which achieve good light extraction efficiency, and to provide methods for manufacturing the light emitting device and the package easily.SOLUTION: A light emitting device 100 is formed including a light emitting element 1 and a package 2. The package 2 has a lead frame 21 placed on a bottom surface of a recessed part 22a; and a resin part 22 supporting the lead frame 21 and forming a side surface of the recessed part 22a. At least a part of an outer surface of the recessed part 22a is covered by a reflection coating 23. The light emitting device 100 is mounted on the bottom surface of the recessed part 22a of the package 2 so that the light emitting element 1 is electrically connected with the lead frame 21.SELECTED DRAWING: Figure 1 |
