| 摘要 |
PROBLEM TO BE SOLVED: To achieve sufficient homogenization of the energizing current of parallel implementation elements, by taking account of the energizing path in the upper arm and lower arm, and the wiring floating inductance thereof.SOLUTION: A semiconductor device includes a first switching element constituting an upper arm circuit, a first diode constituting the upper arm circuit and electrically connected in parallel with the first switching element, a first conductor connected to the high potential side of the first switching element and first diode, a second conductor connected to the low potential side of the first switching element and first diode, and a relay conductor for connecting the upper arm circuit and second conductor. When the semiconductor device is projected from the direction perpendicular the electrode plane of the first switching element, the first switching element and first diode are arranged so that the projection part of the first switching element and the projection part of the first diode overlap the outer circumference of a circle around the relay conductor.SELECTED DRAWING: Figure 3 |
