| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor element and a semiconductor device that have a high reliability.SOLUTION: A semiconductor element comprises: a first layer 1 having a first principal surface; an electrode 2 formed on the first principal surface 1A; a protection film 3 having an opening on a surface of the electrode 2 and formed so as to cover at least an end part of the electrode 2; and a front metal film 4 formed on the electrode 2 in the opening. In a region adjacent to the protection film 3 on a surface 4A of the front metal film 4, a first coating film 6 that has a solder wettability lower than that of the front metal film 4 is formed.SELECTED DRAWING: Figure 1 |
