发明名称 PHOSPHONIUM COMPOUND, EPOXY RESIN COMPOSITION INCLUDING THE SAME AND SEMICONDUCTOR DEVICE PREPARED FROM THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a compound for curing catalysts capable of accelerating curing of an epoxy resin, having good flowability during molding and high curing strength, and being curable even in short curing periods of time.SOLUTION: The invention provides a phosphonium compound represented by formula 1. (Rto Rare each independently an aliphatic hydrocarbon group, an aromatic hydrocarbon group, or the like; Xand Xare each independently an arylene group, a cycloalkylene group, or an alkylene group; Rand Rare each independently hydrogen, a hydroxyl group, an alkyl group, an aryl group, a heteroaryl group, a cycloalkyl group, a heterocycloalkyl group, an arylalkyl group, or a heteroalkyl group; and m is an integer from 0 to 5.SELECTED DRAWING: None
申请公布号 JP2016084342(A) 申请公布日期 2016.05.19
申请号 JP20150207460 申请日期 2015.10.21
申请人 SAMSUNG SDI CO LTD 发明人 KIM MIN GYUM;KWON KI HYEOK;LEE DONG HWAN;CHUNG JOO YOUNG;CHEON JIN MIN;CHOI JIN WOO
分类号 C07F9/54;C07C39/08;C07C39/17;C07C49/83;C07C235/64;C07C235/66;C07C323/20;C08K5/50;C08L63/00 主分类号 C07F9/54
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