发明名称 RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a resin composition which can provide a hardened material which is superior in curvature suppression and smear removal and can form a conductor layer with high peel strength to a surface.SOLUTION: A resin composition contains (A) epoxy resin and (B) curing agent. The (A) epoxy resin contains (A1) epoxy resin having a biphenyl skeleton and a diglycidyl oxy-benzene skeleton. The (B) curing agent contains one or more selected from a phenolic curing agent, a cyanate ester curing agent and an active ester curing agent.SELECTED DRAWING: None
申请公布号 JP2016084413(A) 申请公布日期 2016.05.19
申请号 JP20140217910 申请日期 2014.10.27
申请人 AJINOMOTO CO INC 发明人 NAKAMURA SHIGEO;EDO YUKINORI;TATSUMI SHIRO
分类号 C08G59/24;C08K3/00;C08L63/00 主分类号 C08G59/24
代理机构 代理人
主权项
地址