PRINTED WIRING BOARD AND MANUFACTURING METHOD OF WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a printed wiring board capable of improving mountability and a manufacturing method thereof.SOLUTION: A printed wiring board 10 of the present invention includes: an outermost build-up conductor layer 16A; a solder resist layer 29 laminated on the outermost build-up conductor layer 16A; a plurality of openings 27 formed in the solder resist layer 29 and exposing a part of the outermost build-up conductor layer 16A as a conductor pad 23; and a plurality of plating bumps 41 formed on the conductor pad 23, projecting from the upper surface of the solder resist layer 29, and having an outer peripheral portion arranged on the solder resist layer 29. The shape of at least one plating bump 41 of the plurality of plating bumps 41 is a shape having a flat top surface 41T and a curved outer peripheral surface 41S which is curved so as to be narrowed in accordance with approach to the flat top surface 41T from the solder resist layer 29.SELECTED DRAWING: Figure 3