| 发明名称 |
COPPER ALLOY FOR ELECTRONIC/ELECTRICAL EQUIPMENT, COPPER ALLOY THIN SHEET FOR ELECTRONIC/ELECTRICAL EQUIPMENT, CONDUCTIVE COMPONENT FOR ELECTRONIC/ELECTRICAL EQUIPMENT, AND TERMINAL |
| 摘要 |
One aspect of this copper alloy for an electronic and electrical equipment contains: more than 2.0 mass % to 36.5 mass % of Zn; 0.10 mass % to 0.90 mass % of Sn; 0.15 mass % to less than 1.00 mass % of Ni; and 0.005 mass % to 0.100 mass % of P, with the balance containing Cu and inevitable impurities, wherein atomic ratios of amounts of elements satisfy 3.0<Ni/P<100.0 and 0.10<Sn/Ni<2.90, and Vickers hardness of a surface of an α phase containing Cu, Zn, and Sn is 100 or more. |
| 申请公布号 |
US2016138135(A1) |
申请公布日期 |
2016.05.19 |
| 申请号 |
US201414898717 |
申请日期 |
2014.02.20 |
| 申请人 |
MITSUBISHI MATERIALS CORPORATION ;Mitsubishi Shindoh Co., Ltd. |
发明人 |
Maki Kazunari;Mori Hiroyuki;Yamashita Daiki |
| 分类号 |
C22C9/04;H01B1/02 |
主分类号 |
C22C9/04 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A copper alloy for electronic and electrical equipment, comprising:
more than 2.0 mass % to 36.5 mass % of Zn; 0.10 mass % to 0.90 mass % of Sn; 0.15 mass % to less than 1.00 mass % of Ni; 0.005 mass % to 0.100 mass % of P; and a balance containing Cu and inevitable impurities, wherein an atomic ratio Ni/P of an amount of Ni to an amount of P satisfies a relationship of 3.0<Ni/P<100.0, an atomic ratio Sn/Ni of an amount of Sn to an amount of Ni satisfies a relationship of 0.10<Sn/Ni<2.90, and Vickers hardness of a surface of an α phase containing Cu, Zn, and Sn is 100 or more. |
| 地址 |
Tokyo JP |
