| 发明名称 |
EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ENCAPSULATED USING THE SAME |
| 摘要 |
Disclosed herein is an epoxy resin composition for encapsulating semiconductor devices, the epoxy resin composition including an epoxy resin, a curing agent, inorganic fillers, and a colorant, the colorant including a hydrate. |
| 申请公布号 |
US2016137808(A1) |
申请公布日期 |
2016.05.19 |
| 申请号 |
US201514814271 |
申请日期 |
2015.07.30 |
| 申请人 |
SAMSUNG SDI CO., LTD. |
发明人 |
EOM Tae Shin;YANG Seung Yong;LEE Eun Jung;IM Su Mi |
| 分类号 |
C08K3/24 |
主分类号 |
C08K3/24 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An epoxy resin composition for encapsulating semiconductor devices, the composition comprising: an epoxy resin, a curing agent, an inorganic filler, and a colorant, the colorant including a hydrate. |
| 地址 |
Yongin-si KR |
