COVER TAPE FOR ELECTRONIC PART PACKAGE, PACKAGING MATERIAL FOR ELECTRONIC PART PACKAGE, AND ELECTRONIC PART PACKAGE

摘要

The present invention has as one purpose thereof to provide a cover tape able to serve as a packaging material for an electronic part package from which an electronic part can be removed with exceptional precision from within a recessed portion of a carrier tape, and provides a cover tape for an electronic part package, characterized by having a base material layer, and a heat sealant layer laminated to one surface of the base material layer and sealed to the carrier tape, the heat sealant layer having surface roughness Rz (as stipulated in JIS B0601) of 1.0 μ or greater, and adhesive strength of 0.3 g/mm2 or less with respect to a resin layer of which a polyorganosiloxane is the main component.