ELECTRONIC DEVICE HAVING HEAT CONDUCTING MEMBER

摘要

An electronic device includes a semiconductor module, a wiring substrate, a case member and a heat conducting member. The heat conducting member thermally connects predetermined portions of wiring patterns and a heat conducting pattern of the wiring substrate to a predetermined heat conduction region of a surface of the case member opposing to the wiring substrate. The predetermined heat conduction region is located further from the wiring substrate than a surface of a body portion opposing to the case member. As a result, heat can be radiated and a short can be restricted with the case member having a simple shape. The heat conducting pattern is disposed adjacent to at least one of non-terminal projecting surfaces of the body portion on a surface of the wiring substrate. As a result, an area of a heat conducting passage increases and heat radiation performance can be increased.

主权项

1. An electronic device comprising:
a semiconductor module having a body portion with a rectangular parallelepiped shape and a plurality of terminal portions projecting from two of four side surfaces of the body portion, the two of the four side surfaces of the body portion being referred to as terminal projecting surfaces, the other two of the four side surfaces of the body portion being referred to as terminal non-projecting surfaces; a wiring substrate having a plurality of wiring patterns and a heat conducting pattern, surfaces of the plurality of wiring patterns other than a plurality of connecting portions to which the terminal portions of the semiconductor module are electrically connected and a surface of the heat conducting pattern being covered with solder resist, and the heat conducting pattern being disposed adjacent to at least one of the terminal non-projecting surfaces of the body portion on a surface of the wiring substrate; a case member opposed to the wiring substrate and spaced from the wiring substrate; and a heat conducting member thermally connecting predetermined portions of the wiring patterns and the heat conducting pattern to a predetermined heat conduction region of the case member, the predetermined heat conduction region being a surface of the case member opposing to the wiring substrate and being located further from the wiring substrate than a surface of the body portion opposing to the case member.