| 发明名称 |
METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT WITH IMPRINT, INTEGRATED CIRCUIT WITH IMPRINT, DEVICE FOR FORMING AN INTEGRATED CIRCUIT WITH IMPRINT AND VERIFICATION SYSTEM FOR AN INTEGRATED CIRCUIT WITH IMPRINT |
| 摘要 |
According to various embodiments, a method of manufacturing an integrated circuit may include providing a film structure having at least one of at least one recess or at least one protrusion, and carrying out a film assisted molding process using the film structure to mold an electronic circuit, thereby forming a molding structure including a surface pattern in accordance with the film structure. |
| 申请公布号 |
US2016141187(A1) |
申请公布日期 |
2016.05.19 |
| 申请号 |
US201414541163 |
申请日期 |
2014.11.14 |
| 申请人 |
Infineon Technologies AG |
发明人 |
Marbella Carlo Baterna;Kwan Wai Loon;Chai Min King;Tham Veng Leong |
| 分类号 |
H01L21/56;H01L23/42;B29C51/26;G07C11/00;B29C51/12;H01L23/31;H01L21/67 |
主分类号 |
H01L21/56 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacturing an integrated circuit, the method comprising:
providing a film structure having at least one of at least one recess or at least one protrusion; and carrying out a film assisted molding process using the film structure to mold an electronic circuit, thereby forming a molding structure including a surface pattern in accordance with the film structure. |
| 地址 |
Neubiberg DE |
