发明名称 FUNCTION PANEL, MANUFACTURE METHOD OF FUNCTION PANEL, MODULE, AND INFORMATION PROCESSOR
摘要 PROBLEM TO BE SOLVED: To provide a new function panel excellent in convenience or reliability, and a manufacture method of the new function panel excellent in convenience or reliability.SOLUTION: The function panel comprises: a first substrate; a second substrate including a region overlapping with the first substrate; a joint layer bonding the first substrate and the second substrate; and an insulation layer in contact with the first substrate, the second substrate and the joint layer. This allows a gap that is likely to be generated in a region where the joint layer is in contact with the first substrate or a region where the joint layer is in contact with the second substrate, to be filled with the insulation layer, and further suppresses a phenomenon in which impurities are diffused in a functional layer located in a region surrounded by the first substrate, the second substrate, and the joint layer bonding the first substrate and the second substrate.SELECTED DRAWING: Figure 1
申请公布号 JP2016085460(A) 申请公布日期 2016.05.19
申请号 JP20150209096 申请日期 2015.10.23
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 YAMAZAKI SHUNPEI;YOKOYAMA KOHEI;HIRAKATA YOSHIHARU
分类号 G09F9/00;C23C16/40;C23C16/455;G06F3/041;G09F9/30;H01L27/32;H01L51/50;H05B33/10;H05B33/14 主分类号 G09F9/00
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