发明名称 |
FUNCTION PANEL, MANUFACTURE METHOD OF FUNCTION PANEL, MODULE, AND INFORMATION PROCESSOR |
摘要 |
PROBLEM TO BE SOLVED: To provide a new function panel excellent in convenience or reliability, and a manufacture method of the new function panel excellent in convenience or reliability.SOLUTION: The function panel comprises: a first substrate; a second substrate including a region overlapping with the first substrate; a joint layer bonding the first substrate and the second substrate; and an insulation layer in contact with the first substrate, the second substrate and the joint layer. This allows a gap that is likely to be generated in a region where the joint layer is in contact with the first substrate or a region where the joint layer is in contact with the second substrate, to be filled with the insulation layer, and further suppresses a phenomenon in which impurities are diffused in a functional layer located in a region surrounded by the first substrate, the second substrate, and the joint layer bonding the first substrate and the second substrate.SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016085460(A) |
申请公布日期 |
2016.05.19 |
申请号 |
JP20150209096 |
申请日期 |
2015.10.23 |
申请人 |
SEMICONDUCTOR ENERGY LAB CO LTD |
发明人 |
YAMAZAKI SHUNPEI;YOKOYAMA KOHEI;HIRAKATA YOSHIHARU |
分类号 |
G09F9/00;C23C16/40;C23C16/455;G06F3/041;G09F9/30;H01L27/32;H01L51/50;H05B33/10;H05B33/14 |
主分类号 |
G09F9/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|