发明名称 LEAD FRAME AND MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a lead frame and a manufacturing method thereof that can easily peel off a tape strongly jointed on the lead frame.SOLUTION: In a lead frame 10 where a plastic leak prevention tape 13 is stuck to a back surface of a lead frame body 12 processed into a specified shape, notch parts 15 and 16 which are a starting point 17 for detaping are formed at an end of the lead frame body 12, and an area 18 that weakens joint strength between the plastic leak prevention tape 13 and the lead frame body 12 is provided around the notch parts 15 and 16 at the back surface of the lead frame body 12.SELECTED DRAWING: Figure 1
申请公布号 JP2016086029(A) 申请公布日期 2016.05.19
申请号 JP20140216422 申请日期 2014.10.23
申请人 MITSUI HIGH TEC INC 发明人 ISHIBASHI TAKAHIRO
分类号 H01L23/50 主分类号 H01L23/50
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