GLASS SUBSTRATE CUTTING METHOD

摘要

PROBLEM TO BE SOLVED: To easily and stably cut strengthened glass while restraining deterioration of strength.SOLUTION: This glass substrate cutting method for cutting strengthened glass having compression stress on a surface and tensile stress inside includes a processing trace forming step, and a cutting step. In the processing trace forming step, the processing trace is formed inside a substrate along a cut scheduled line by collecting laser at a first depth position in a region having the tensile stress inside the substrate and scanning the laser along the cut scheduled line. In the cutting step, cracks reaching the top or rear surface of the substrate are formed to cut the substrate by moving a laser collecting position nearer a second depth position on the top or rear surface of the substrate than the second depth position at a scanning finish part and scanning the laser following the laser scanning in the processing trace forming step.SELECTED DRAWING: Figure 2