| 摘要 |
PROBLEM TO BE SOLVED: To provide a film deposition method of a metal film, the method being able to deposit the metal film having a good adhesion over an entire surface of a resin substrate and having a good mass-productivity.SOLUTION: A film deposition method of a metal film according to the invention arranges a resin substrate W in a vacuum chamber B in which a metal target 2 is arranged, introduces sputtering gas to the vacuum chamber, forms plasma by applying a predetermined voltage to a target, and deposits metal films Mf1, Mf2 on at least one surface of the resin substrate by sputtering the target, the voltage being a pulse voltage, the pulse voltage having a frequency of less than 1 kHz, and a pulse width in a range of 1 μs - 1 ms.SELECTED DRAWING: Figure 3 |
