| 发明名称 |
DOUBLE-SIDED AND MULTILAYERED PRINTED CIRCUIT BOARD FABRICATION USING INKJET PRINTING |
| 摘要 |
The disclosure relates to methods, kits and compositions for direct printing of double- sided and/or multilayered printed circuit boards. Specifically, the disclosure relates to the printing of conductive leads and insulating portions of printed circuit boards using inkjet printing. |
| 申请公布号 |
WO2016077844(A1) |
申请公布日期 |
2016.05.19 |
| 申请号 |
WO2015US62046 |
申请日期 |
2015.11.22 |
| 申请人 |
NANO-DIMENSION TECHNOLOGIES, LTD.;THE IP LAW FIRM OF GUY LEVI, LLC |
发明人 |
FIMA, SHARON;ELIMELECH, HILA |
| 分类号 |
H01L21/4763 |
主分类号 |
H01L21/4763 |
| 代理机构 |
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代理人 |
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