发明名称 PRINT WIRING BOARD, METHOD FOR MANUFACTURING PRINT WIRING BOARD, AND METHOD FOR INSPECTING PRINT WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a print wiring board capable of being inspected when there is a defect.SOLUTION: In a print wiring board 10 on which an electronic component 12 is mounted and a plurality of output wirings 13 connected with the electronic component 12 are formed, a defect inspection test pad 15 is formed on the plurality of output wirings 13 and a shipment evaluation test pad 14 is covered with a resin cover 15.SELECTED DRAWING: Figure 2
申请公布号 JP2016086109(A) 申请公布日期 2016.05.19
申请号 JP20140219021 申请日期 2014.10.28
申请人 RICOH CO LTD 发明人 YAMANAKA SEIJI
分类号 H05K3/00;G01R31/28;H05K1/02 主分类号 H05K3/00
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