发明名称 |
PRINT WIRING BOARD, METHOD FOR MANUFACTURING PRINT WIRING BOARD, AND METHOD FOR INSPECTING PRINT WIRING BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide a print wiring board capable of being inspected when there is a defect.SOLUTION: In a print wiring board 10 on which an electronic component 12 is mounted and a plurality of output wirings 13 connected with the electronic component 12 are formed, a defect inspection test pad 15 is formed on the plurality of output wirings 13 and a shipment evaluation test pad 14 is covered with a resin cover 15.SELECTED DRAWING: Figure 2 |
申请公布号 |
JP2016086109(A) |
申请公布日期 |
2016.05.19 |
申请号 |
JP20140219021 |
申请日期 |
2014.10.28 |
申请人 |
RICOH CO LTD |
发明人 |
YAMANAKA SEIJI |
分类号 |
H05K3/00;G01R31/28;H05K1/02 |
主分类号 |
H05K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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