| 摘要 |
PROBLEM TO BE SOLVED: To provide a system and a method for treating a surface of a microelectronic substrate with a cryogenic fluid mixture used to treat an exposed surface of a microelectronic substrate.SOLUTION: The fluid mixture is expanded through a nozzle to form an aerosol spray or gas cluster jet (GCJ) spray, which impinges on a microelectronic substrate, whereby particles are removed from a surface of the microelectronic substrate. The fluid mixture may include nitrogen, argon, helium, neon, xenon, krypton, carbon dioxide, or any combination thereof. The incoming fluid mixture is maintained at a pressure larger than an atmospheric pressure, and at a temperature higher than the condensation temperature of the fluid mixture. The fluid mixture is expanded in a treatment chamber to form an aerosol or gas cluster spray. In this embodiment, the nozzle is positioned within 50 mm of the microelectronic substrate during the treatment, more preferably within 10 mm of the microelectronic substrate.SELECTED DRAWING: Figure 1 |
