发明名称 |
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
In manufacturing an electronic device in which a semiconductor chip including an element layer formed on a front surface of a substrate and a heat sink to perform heat radiation of the semiconductor chip are connected via a heat spreader, a first heat spreader is formed on a rear surface of the semiconductor chip using a first carbon nanotube, a second heat spreader is formed on the heat sink using a second carbon nanotube, and the first heat spreader and the second heat spreader are caused to adhere to each other. With this configuration, a highly reliable electronic device that has very low heat resistance and achieves efficient heat radiation with a relatively simple configuration is fabricated. |
申请公布号 |
US2016141222(A1) |
申请公布日期 |
2016.05.19 |
申请号 |
US201615001575 |
申请日期 |
2016.01.20 |
申请人 |
FUJITSU LIMITED |
发明人 |
SATO Motonobu |
分类号 |
H01L23/367;H01L21/48;H01L23/373 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
1. An electronic device, comprising:
an electronic part including an element layer formed on a front surface of a substrate; a heat sink performing heat radiation of the electronic part; and a heat spreader provided between a rear surface of the electronic part and the heat sink,
wherein the heat spreader comprisesa first heat spreader formed on the rear surface of the electronic part and comprising a first carbon nanotube, anda second heat spreader formed on the heat sink and comprising a second carbon nanotube. |
地址 |
Kawasaki-shi JP |