发明名称 |
PROBE PAD WITH INDENTATION |
摘要 |
An integrated electronic circuit has probe indentations filled by a hard covering substance. The integrated circuit device results from a process of manufacturing including forming a substrate comprising a plurality of functional components of the electronic circuit, creating a plurality of conductive layers on such substrate to form an electric contact region with high hardness equal to or greater than a first hardness value of about 300 HV, contacting the electric contact region with a probe thereby causing an indentation. The process further comprises, after the test run, creating a covering conductive layer on at least one part of the electric contact region contacted by the probe to fill the indentation. |
申请公布号 |
US2016141216(A1) |
申请公布日期 |
2016.05.19 |
申请号 |
US201615005178 |
申请日期 |
2016.01.25 |
申请人 |
STMicroelectronics S.r.l. |
发明人 |
Pagani Alberto |
分类号 |
H01L21/66;H01L23/532;H01L23/528;G01R31/28;H01L21/768 |
主分类号 |
H01L21/66 |
代理机构 |
|
代理人 |
|
主权项 |
1. A method, comprising:
forming an indentation in a contact pad disposed over a substrate; and forming a layer of conductive material in the indentation. |
地址 |
Agrate Brianza IT |