Method for Stacking Electronic Components

摘要

A method of forcing a stacked electronic component, and an electronic component formed by the method, therein the method includes:;providing a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination;;providing a first lead frame plate and a second lead frame plate wherein the first lead frame plate and the second lead frame plate comprises barbs and leads;;providing a molded case comprising a cavity and a bottom; and terming a sandwich of electronic components in an array between the first lead frame plate and the second lead frame plate which the barbs protruding towards the electronic components and the leads extending through the bottom.