| 摘要 |
There are provided a compound containing a phenolic hydroxyl group, which exhibits excellent heat resistance and excellent flame retardancy in terms of a cured product thereof, a phenolic resin including the same, a curable composition and a cured product thereof, a semiconductor sealing material, and a printed circuit board. The phenolic resin contains a binuclear compound (X) represented by the following Structural Formula (I), and a trinuclear compound (Y) represented by the following Structural Formula (II) as essential components:;;wherein each of j and k is 1 or 2, and at least one of j and k is 2;;;wherein each of l, m and n is 1 or 2, and at least one of l, m, and n is 2. |
| 主权项 |
1. A phenolic resin comprising, as essential components:
a binuclear compound (X) represented by the following Structural Formula (I); and a trinuclear compound (Y) represented by the following Structural Formula (II), wherein each of R1 and R2 is any one of an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, an aryl group and an aralkyl group, each of p and q is 0, 1 or 2, in a case where p or q is 2, two R1's or R2's may be the same as or different from each other, each of j and k is 1 or 2, and at least one of j and k is 2; wherein each of R3, R4, and R5 is any one of an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, an aryl group and an aralkyl group, each of r, s and t is 0, 1 or 2, in a case where r, s or t is 2, two R3's, R4's or R5's may be the same as or different from each other, each of 1, m and n is 1 or 2, and at least one of 1, m and n is 2. |
