| 摘要 |
A metal layer structure formed on a plastic surface. The metal layer structure comprises a primer layer (2) formed on the surface of a plastic substrate (1), a metal texture layer (3) that is formed on the primer layer (2) and is a conductive film layer formed by means of ion sputtering, a pyrophosphate copper layer/watt nickel layer (4) formed on the metal texture layer (3), a light copper layer (5) formed on the pyrophosphate copper layer/watt nickel layer (4), a semi-light nickel layer (6) formed on the light copper layer (5), a light nickel layer (7) formed on the semi-light nickel layer (6), a sealing nickel layer (8) formed on the light nickel layer (7), and a light chromium layer (9) formed on the sealing nickel layer (8). Also, a surface treatment process for a metal layer structure formed on a plastic surface. |
