| 摘要 |
PROBLEM TO BE SOLVED: To provide a CSP-type light-emitting device including a semiconductor light-emitting element and a protection element, and capable of manufacturing a wafer level process.SOLUTION: A light-emitting device 100 comprises: a semiconductor light-emitting element 1 including a semiconductor laminate 12 and an n-side electrode 13 and a p-side electrode 15 provided on one surface side of the semiconductor laminate 12; a protection element 2 provided on the one surface side of the semiconductor laminate 12 and including an electrode 21 connected facing the n-side electrode 13 and the p-side electrode 15; a negative external connection terminal 3n electrically connected to the n-side electrode 13 and provided on the n-side electrode 13 separated from the protection element 2 and a positive external connection terminal 3p electrically connected to the p-side electrode 15 and provided on the p-side electrode 15 separated from the protection element 2; and a resin layer 4 provided on the one surface side of the semiconductor laminate 12 so as to embed the protection element 2. The upper surfaces of the negative external connection terminal 3n and the positive external connection terminal 3p are exposed from the resin layer 4. The light-emitting device 100 is further provided with a negative extension terminal 5n and a positive extension terminal 5p.SELECTED DRAWING: Figure 1B |
