| 摘要 |
Provided are the following: an interposer used in three-dimensional mounting, or a protective sheet for protecting bumps provided to a semiconductor chip; and a three-dimensional mounting method that uses the protective sheet. More specifically, provided is a semiconductor chip mounting method in which, using a pressurizing and/or heating means, a substrate which has a plurality of bumps and a semiconductor chip which is placed on the substrate are pressurized and/or heated while being sandwiched and held, and as a result thereof, the semiconductor chip is mounted on the substrate. The semiconductor chip mounting method is characterized in that, if a site (bump site) where the plurality of bumps of the substrate are present is sandwiched and held by the pressurizing and/or heating means, pressurizing and/or heating is carried out with a protective sheet interposed between the pressurizing and/or heating means and the substrate, the protective sheet effectively only coming into contact with a substrate surface of the bump site. |
