发明名称 静電気放電保護構造及びその製造方法
摘要 The present disclosure provides an electrostatic discharge protection structure and a fabrication method thereof. The structure includes: a substrate of a first type of conductivity, a well region of a second type of conductivity, a substrate contact region in the substrate and of the first type of conductivity, a well contact region in the well region and of the second type of conductivity, a substrate counter-doped region between the substrate contact region and the well contact region and of the second type of conductivity, a well counter-doped region between the substrate contact region and the well contact region and of the first type of conductivity, a communication region at a lateral junction between the substrate and the well region, a first isolation region between the substrate counter-doped region and the communication region, a second isolation region between the well counter-doped region and the communication region, an oxide layer having one end on the first isolation region and another end on the substrate, and a field plate structure on the oxide layer. A threshold voltage may be adjusted by the width and position of the field plate structure.
申请公布号 JP5918365(B2) 申请公布日期 2016.05.18
申请号 JP20140521946 申请日期 2013.04.27
申请人 无錫華潤上華半導体有限公司CSMC TECHNOLOGIES FAB1 CO., LTD 发明人 胡勇海;代萌;林中▲うぃ▼;汪広羊
分类号 H01L21/329;H01L21/822;H01L27/04;H01L27/06;H01L29/06;H01L29/861;H01L29/868;H01L29/87 主分类号 H01L21/329
代理机构 代理人
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