| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress peeling at an interface of a bump joint. <P>SOLUTION: There is provided a semiconductor device comprising: an element 10 on which a first bump 32 is formed; and a substrate 20 on which a second bump 34 is formed and which has a thermal expansion coefficient different from that of the element. A terminal surface 33 of the first bump is formed so as to be inclined toward an inside of the element, a terminal surface 35 of the second bump is formed so as to correspond to the terminal surface of the first bump, and the terminal surface of the first bump and the terminal surface of the second bump are bonded. <P>COPYRIGHT: (C)2013,JPO&INPIT |
