发明名称 COMPOSITE ELECTRONIC COMPONENT, BOARD FOR MOUNTING THE SAME AND PACKING UNIT THEREOF
摘要 Provided are a composite electronic component capable of reducing acoustic noises, a mounting board of the composite electronic component, and a package. The present invention relates to the composite electronic component which comprises: a stacked ceramic capacitor including a first ceramic main body in which a plurality of dielectric layers and inner electrodes arranged to face each other interposing the dielectric layer are stacked, and first and second outer electrodes arranged in both end units of the first ceramic main body; and a ceramic chip arranged in a lower part of the stacked ceramic capacitor and including a second ceramic main body made of ceramic and first and second terminal electrodes which are arranged on both end units of the second ceramic main body and are connected to the first and second outer electrodes. A lengthwise direction of the stacked ceramic capacitor is different from that of the ceramic chip.
申请公布号 KR20160055424(A) 申请公布日期 2016.05.18
申请号 KR20140155179 申请日期 2014.11.10
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 PARK, SANG SOO;JUN, KYOUNG JIN;AHN, YOUNG GHYU;PARK, HEUNG KIL
分类号 H01G4/40;H01G2/06 主分类号 H01G4/40
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