| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a device having a solid-state device which is hardly damaged. <P>SOLUTION: A method for manufacturing a device having a solid-state device comprises the steps of: preparing a flexible substrate 1 and a rigid substrate 2; forming an ultraviolet irradiation region 4 and an ultraviolet non-irradiation region by partly irradiating one side of the flexible substrate with ultraviolet ray 3 (first ultraviolet irradiation step); forming an ultraviolet irradiation region 5 by irradiating one side of the rigid substrate with the ultraviolet ray (second ultraviolet irradiation step); bringing an ultraviolet irradiation region 9 of the flexible substrate into contact with an ultraviolet irradiation region 11 of the rigid substrate so that one side of the ultraviolet irradiation region 9 and one side of the ultraviolet irradiation region 11 face with each other and forming a composite 6 to which the flexible substrate and the rigid substrate are directly adhering; forming a solid-state device 7 on an ultraviolet non-irradiation region 10 of the flexible substrate of the composite; cutting the flexible substrate in the ultraviolet non-irradiation region of the flexible substrate of the composite; and separating the rigid substrate from the composite. <P>COPYRIGHT: (C)2013,JPO&INPIT |
