| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which facilitates repair of detaching a semiconductor package form a mounting substrate, and which improves shock resistance of a connection part between the semiconductor package and the mounting substrate. <P>SOLUTION: A semiconductor device 100 comprises: a semiconductor package 1 to which a semiconductor element 4 is connected; and a mounting substrate 2 electrically and mechanically connected to the semiconductor package 1 via solder bumps 3. The semiconductor package 1 includes a semiconductor package wiring board 5 to which the semiconductor element 4 is connected and which is connected to the mounting substrate 2. The semiconductor package wiring board 5 includes: a first stress relaxation layer 21 arranged on a core layer 11 side of an electrode pad 22 formed on the semiconductor package wiring board 5; and a second stress relaxation layer 34 arranged on an interlayer insulation layer 31 side of an electrode pad 33 formed on the mounting substrate 2. An elastic modulus of the first stress relaxation layer 21 at 25°C is not greater than 2.5 GPa. An elastic modulus of the second stress relaxation layer 34 at 25°C is not greater than 3 GPa and a heat expansion coefficient of the second stress relaxation layer 34 in a plane direction at 25°C is not greater than 8×10<SP POS="POST">-6</SP>/°C. <P>COPYRIGHT: (C)2013,JPO&INPIT |
