发明名称 シート剥離装置および剥離方法
摘要 <P>PROBLEM TO BE SOLVED: To provide a sheet exfoliating device and a sheet exfoliating method by which an adhesive sheet can be smoothly exfoliated from an adhered body while restraining rising or cracks of the adhered body such as a wafer. <P>SOLUTION: An end of an adhesive sheet S is exfoliated from a wafer W with a corner P of an adhesion area R as a starting point, and therefore, rising of the wafer W together with an exfoliating tape T can be restrained, and the end of the adhesive sheet S can be reliably exfoliated from the wafer W. In this manner, after the end of the adhesive sheet S is exfoliated, the adhesive sheet S is pulled by the exfoliating tape T via the adhesion area R to entirely exfoliate the adhesive sheet S. Thereby, while rising and cracks of the wafer W can be reliably prevented, the adhesive sheet S can be smoothly exfoliated from the wafer W. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP5918927(B2) 申请公布日期 2016.05.18
申请号 JP20110055507 申请日期 2011.03.14
申请人 リンテック株式会社 发明人 上道 厚史
分类号 H01L21/683 主分类号 H01L21/683
代理机构 代理人
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